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2 Inch GaN-On-Sapphire Template
Dimensions: Ф 50.8 mm ± 1 mm
Thickness:4.5µm, 20 µm
Orientation:C-plane(0001) ± 0.5°
Useable Surface Area:> 90% -
氮化镓晶片 蓝宝石氮化镓衬底晶片
尺寸:2英寸
厚度:4.5um 20um
掺杂:非掺杂,硅掺杂,镁掺杂
衬底结构:GaN-On-Sapphire
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4 Inch GaN-On-Sapphire Template
Dimensions: Ф 100 mm ± 0.1 mm
Thickness:4.5 µm, 20 µm
Orientation:C-plane(0001) ± 0.5°
Useable Surface Area:> 90% -
氮化镓衬底晶片 4英寸GaN氮化镓衬底片
尺寸:4英寸
厚度:4.5um 20um
掺杂:非掺杂,硅掺杂
衬底结构:GaN-On-Sapphire -
2 Inch Free-Standing GaN Substrate
Dimensions: Ф 50.8 mm ± 1 mm
Thickness: 350 ± 25 µm
Useable Surface Area: > 90%
Total Thickness Variation: ≤ 15 µm -
氮化镓自支撑晶片 2英寸GaN衬底晶片
尺寸:2英寸
厚度:350um
掺杂:非掺杂,硅掺杂,铁掺杂
等级:测试级,研究级,产品级,优选级
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4 Inch Free-Standing GaN Substrate
Dimensions: Ф 100 mm ± 1 mm
Thickness: 400 ± 50 µm
Useable Surface Area: > 90%
Total Thickness Variation: ≤ 40 µm -
氮化镓自支撑衬底片 4英寸GaN氮化镓晶片
尺寸:4英寸
厚度:400um
掺杂:非掺杂,硅掺杂
电阻率:≤0.5Ω.cm
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Square Free-Standing GaN Substrate
Dimension:10*15mm²
Thickness: 350±25um
Useable Surface Area:>90%
Conduction Type: N Type,SI Type
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10*10.5mm2方形氮化镓衬底晶片
尺寸:10*10.5mm2
厚度:350um
掺杂:非掺杂,硅掺杂,铁掺杂
电阻率:<0.05Ω.cm
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GaN Epitaxial On Si For RF HEMT
GaN-On-Si Epi Wafer For RF HEMT
Substrate Diameter: 6 inch (111)
Substrate Thickness:1000um
Epi Layer Total Thickness: 2~5.5um -
4 inch GaN Epitaxial On Si For Power HEMT
GaN-On-Si Epi Wafer For Power HEMT D-Mode
Substrate Diameter: 2inch,4inch,6inch, 8inch
Substrate Thickness: 675,1000um
Epi Layer Total Thickness: 2~5.5um -
Gan Epitaxial On Si For Power HEMT E-Mode
GaN-On-Si Epi Wafer For Power HEMT-E Mode
Substrate Diameter: 2-8 inch(111)
Substrate Thickness: 675,1000um
Epi Layer Total Thickness: 2~5.5um -
GaN/SiN Cap AlGaN Barrier Epi with 25% Al HEMT
Spec: 4 inch,6 inch,8 inch
Substrate: Silicon
Thickness: 675um 1000um
Substrate grade: Production
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4 inch硅基AlGaN/GaN外延片Power HEMT
衬底尺寸:4 英寸 6 英寸 8英寸
衬底材质:硅
衬底厚度:675um 1000um
衬底等级:产品级 -
GaN Epitaxial On SiC For Power HEMT
GaN-On-SiC Epi Wafer For Power HEMT
Substrate Size: 4 inch,6 inch
Substrate Thickness: 500um
GaN Buffer Layer: 2-3um