GaN Epitaxial On Si For RF HEMT
GaN-On-Si Epi Wafer For RF HEMT
Substrate Diameter: 6 inch (111)
Substrate Thickness:1000um
Epi Layer Total Thickness: 2~5.5um
Product Description
As the leading manufacturer and supplier of GaN Epi wafer and GaN-On-Si Epi Wafer For RF HEMT application, Homray Material Technology offers 6 inch GaN on Si Epi (Epitaxial) wafer. The HEMT RF product is a state-of-the-art (Al,Ga)N/GaN heteroepitaxial layer structure deposited crack-free on a (111) high resistance Si-wafer for RF power applications. Homray Material Technology offers two standard HEMT structures: one having an Al0.25Ga0.75N barrier without an AlN spacer layer and the other one having an Al0.25Ga0.75N barrier with an AlN spacer layer. Custom barrier, cap layer and in-situ SiN designs are available upon request.
The proprietary high-voltage buffer design offers low leakage currents, high breakdown voltage, low dispersion and a consistently low wafer bow. The epitaxial layer consists of an active heterostructure based on an AlGaN layer and a GaN channel, providing high electron mobility and low sheet resistivity.
Standard Layer Specification For RF HEMT
Standard Layer Structure Key Features
Characterization Specification
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